TM211
国家重点研发计划资助项目(2022YFF0708400)
State Key Research and development program
汤贝贝,张国强,李群,张子阳,邵剑,吴鹏.光学麦克风封装材料相容性试验[J].电力工程技术,2023,42(5):20-29. TANG Beibei, ZHANG Guoqiang, LI Qun, ZHANG Ziyang, SHAO Jian, WU Peng. Compatibility test of optical microphone packaging materials[J]. Electric Power Engineering Technology,2023,42(5):20-29.
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